By Mohd N. Tamin, Norhashimah M. Shaffiar (auth.)
This e-book provides a scientific technique in acting reliability overview of solder joints utilizing Finite aspect (FE) simulation. crucial standards for FE modelling of an digital package deal or a unmarried reflowed solder joint subjected to reliability attempt stipulations are elaborated. those hide assumptions thought of for a simplified actual version, FE version geometry improvement, constitutive types for solder joints and elements of FE version validation. basics of the mechanics of solder fabric are properly reviewed when it comes to FE formulations. suggestion of wear is brought besides deliberation of cohesive sector version and continuum harm version for simulation of solder/IMC interface and bulk solder joint failure, respectively. functions of the deliberated method to chose difficulties in assessing reliability of solder joints are established. those industry-defined research-based difficulties contain solder reflow cooling, temperature biking and mechanical fatigue of a BGA package deal, JEDEC board-level drop attempt and mechanisms of solder joint fatigue. Emphasis is put on actual quantitative evaluation of solder joint reliability via uncomplicated realizing of the mechanics of fabrics as interpreted from result of FE simulations. The FE simulation technique is instantly appropriate to varied different difficulties in mechanics of fabrics and structures.
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Extra resources for Solder Joint Reliability Assessment: Finite Element Simulation Methodology
Path a–b corresponds to reflow cooling from 183–25 °C, while the subsequent heating and cooling part of the first temperature cycle are represented by path b–c and c–d respectively. The inelastic shear strain range is defined as the range (maximum value–minimum value) of shear strain corresponding to zero shear stress. The magnitude of the shear strain range is then used in Eq. 8) for estimating the fatigue life of the solder joint corresponding to the applied reliability temperature profile. Availability of measured reliability data for identical test packages could be used to establish the validity of the FE model.
Mechanical interaction among the different components, including the solder joints, substrate, IMC layer, copper traces and PCB, could lead to complex stress fields, thus finer size elements are prescribed for these components in the vicinity of the solder joints. In addition, four layers of elements are prescribed through the thickness of PCB and substrate in order to yield an adequate accuracy of the displacement field (warpage) of the board throughout the analysis. The predicted warpage of the substrate greatly affects the deformation of the adjacent array of solder joints, thus influences the resulting strains and stresses in the solder.
Other aspects of FE model validation are argued through rationalizing the predicted response of the test assembly from an understanding of the mechanics of materials and limited experimental observations. Such information provides qualitative validation of the FE model. 8 Interpretation of Results Results of the FE simulation are interpreted for information on displacements, strains and stresses, particularly in the critical solder joint that dictates the reliability of the test assembly. Such interpretation is meaningful only after validity of the FE model has been established, as discussed above.