By Thomas Moore
Chapters during this quantity tackle very important features of IC programs. Analytical strategies applicable for IC package deal characterization are established via examples of the size of serious functionality parameters and the research of key technological difficulties of IC applications. matters are mentioned which have an effect on quite a few package deal varieties, together with plastic surface-mount programs, airtight programs, and complex designs equivalent to flip-chip, chip-on-board and multi-chip models.
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Extra info for Characterization of Integrated Circuit Packaging Materials
Example text
These include optical, IR, and SEM. C-AM, X-ray radiography, and metallography provide the tools for physical probing inside the package. References 1 M. Shell-De Guzman and M. Mahaney. 30th International Reliability Physics Sym. 1992, p. 251. 2 R. Milburn and K. Rackley. "New Technology in Electronic Packaging," ASM International. 11, 1990. 3 C. M. Vicroy, J. H. Linn, and R. W. Belcher. International Sym. for Testing and Failure Analysis. 1990, p. 149. 4 T. A. Anderson and K. L. Evans. International Sym.
14, the lower the viscosity or greater the flowability of the mold compound, the higher the adhesion strength. Although the post-cured samples demonstrate lower adhesion than the as-molded samples, this same trend appears. Complete understanding of the effect of the apparent viscosity of the mold compound on adhesion, however, may also require knowledge of a mold compounds viscoelasticity. One reason may be that, even if the initial phase of contact is perfect, subsequent development of an elastic component during the cure reaction may cause retraction and create delamination.
2 titact Angle, 7 , CH2I2 dyne/cm Cu lead frame surface energy changes accompanying thermal oxidation. MOLD COMPOUND ADHESION AND STRENGTH Chapter 2 500 400 1 & 300 200 Η 100 CuO Aged @ 175 °C for168hrs. 6 MC-103 MC-104 Effect of copper oxide structures on peel adhesion. common belief that the metal oxides produce a high surface energy which results in better adhesion. 2, the progression of surface Cu oxide formation on Olin Cu-110 and Cu-194 as a function of heat aging time at 175 °C is given in terms of both polar and nonpolar characters, which in turn are calculated from the experimentally observed contact angles.